Custom OS2 MTP®-8 APC to 4x MDC UPC Harness Cable, Next-Gen High Density

Custom OS2 MTP®-8 APC to 4x MDC UPC Harness Cable, Next-Gen High Density

  • Next-Gen VSFF Technology: Equipped with MDC (Miniature Duplex Connectors), delivering exactly 3x the port density of standard LC connectors, designed for 400G/800G applications.

  • Direct Access Push-Pull Boot: Features an innovative push-pull boot on the MDC connectors for effortless insertion and extraction in extremely hyper-dense patch panels.

  • Base-8 Single-Mode Efficiency: Seamlessly breaks out a 40G/100G/400G MTP/MPO port into four discrete MDC duplex channels over OS2 single-mode fiber.

  • Precision Polish: MTP APC (Angled) polish minimizes back reflection for flawless single-mode transmission, paired with MDC UPC ends.

  • Bespoke Factory Customization: Backed by our robust 400-500 employee manufacturing facility, we offer fully customized breakout lengths, staggered legs, and rapid fulfillment for your next-generation architecture.

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Product Overview

The Wolontek Custom OS2 MTP-8 APC to 4x MDC UPC Harness is engineered to meet the extreme density demands of tomorrow's hyperscale data centers. As network speeds migrate to 400G, 800G, and beyond, traditional LC connectors consume too much valuable faceplate space. This harness solves that bottleneck by utilizing the MDC (Miniature Duplex Connector)—a Very Small Form Factor (VSFF) interface that provides three times the density of a standard LC duplex connector.

Designed for parallel optics breakout applications, this harness connects a high-speed MTP-8 port to four discrete MDC ports. It is the perfect cabling solution for connecting cutting-edge transceivers like SFP-DD, QSFP-DD, and OSFP. As a direct manufacturer, we build these next-gen harnesses exactly to your rack's specifications, ensuring zero cable slack and optimal airflow.

Key Features

  • Triple Your Density: The MDC connector allows for up to 144 fibers (72 duplex ports) in a single RU space, maximizing your existing infrastructure ROI.

  • Effortless Cable Management: The MDC's integrated push-pull boot mechanism allows technicians to easily add or remove cables in heavily congested spaces without disturbing adjacent links.

  • Low Insertion Loss (IL): Premium US Conec MTP® and highly precise MDC ferrules guarantee rigorous low-loss performance (MTP ≤ 0.35dB) crucial for high-speed single-mode optical budgets.

  • Custom Staggered Breakouts: We can engineer the 4x MDC breakout legs with staggered lengths to perfectly cascade across your high-density switch ports, eliminating "waterfall" cable clutter.

  • Carrier-Grade Reliability: Every assembly undergoes strict 3D interferometry and optical performance testing before leaving our production lines.

Technical Specifications

Specification Details
Connector A 1x MTP®-8 (Female, No Pins) - APC Polish
Connector B 4x MDC Duplex - UPC Polish
Form Factor VSFF (Very Small Form Factor)
Fiber Category OS2 Single-mode 9/125μm
Boot Style (MDC) Direct Access Push-Pull Boot
Insertion Loss (MTP) ≤ 0.35dB
Insertion Loss (MDC) ≤ 0.25dB
Return Loss (MTP APC) ≥ 60dB
Return Loss (MDC UPC) ≥ 50dB
Polarity Type B (Standard Breakout)

Application Scenarios

This Next-Gen High-Density harness is specifically designed for forward-looking architectures:

  1. 400G Breakout Applications: Splitting a 400GBASE-DR4/XDR4 transceiver (QSFP-DD/OSFP) into four discrete 100GBASE-DR links (SFP-DD).

  2. Hyperscale Data Centers: Maximizing patch panel density in space-constrained cloud computing environments.

  3. Edge Computing: Delivering massive bandwidth in micro-data centers where physical rack space is at an absolute premium.

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